Research
Structured applied research in verification, test, reliability and AI-driven engineering systems.
SIS conducts research to anticipate structural inflection points in semiconductor engineering — from scalable verification architectures and advanced 3DIC methodologies to memory test, repair strategies, reliability modeling, and AI-augmented engineering systems.
Research Positioning
- ▹Methodological rigor — formal foundations, reproducibility, standards alignment.
- ▹Industrial relevance — direct applicability to verification, DFT, test, and reliability.
- ▹Architectural foresight — anticipating complexity in chiplet and AI-integrated systems.
Focus Areas
Advanced Verification
Scalable and governance-aware methodologies.
- • Chiplet systems
- • Cross-layer coherence
- • Safety formalization
Test & 3DIC
Evolution of test infrastructures.
- • 3DIC test architectures
- • Repair strategies
- • Data-centric analytics
Memory Test
High-density SRAM & NVM technologies.
- • BIST optimization
- • Failure classification
- • Redundancy analysis
Reliability
Predictive lifecycle integrity.
- • Degradation modeling
- • Systemic failure detection
- • Post-silicon feedback
Applied AI
AI-augmented engineering.
- • Anomaly detection
- • Coverage acceleration
- • Decision support
Research Centers & Labs
SIS collaborates with global research centers to align academic innovation with industrial deployment.
- ▹ Joint research programs and consortium leadership
- ▹ Doctoral and post-doctoral co-supervision
- ▹ Technical advisory for funded initiatives
Standards & Publications
Driving the evolution of engineering standards and methodological frameworks.
- ▹ Participation in IEEE working groups
- ▹ Technical position papers & peer-reviewed conferences
- ▹ Executive technical briefings
Research Portfolio — By Domain
Advanced Memory
BIST, repair methodologies, and NVM reliability.
DFT & 3DIC
Heterogeneous integration test strategies.
Verification
Scalable coherence and formal verification.
Reliability
Predictive lifecycle integrity modeling.
Applied AI
AI-assisted engineering innovation.
Research Collaboration & Technical Exchange
Engage SIS for joint research initiatives, conference collaboration, doctoral co-supervision or strategic technical programs.
Contact SIS